File Name: electronic packaging materials and their properties book .zip
Chapter Officers. Technical Support. ASM Staff Directory. Patrick McCluskey, Terrance J. Packaging materials strongly effect the effectiveness of an electronic packaging system regarding reliability, design, and cost.
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer. Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic discharge. Product safety standards may dictate particular features of a consumer product, for example, external case temperature or grounding of exposed metal parts. Prototypes and industrial equipment made in small quantities may use standardized commercially available enclosures such as card cages or prefabricated boxes. Mass-market consumer devices may have highly specialized packaging to increase consumer appeal. Electronic packaging is a major discipline within the field of mechanical engineering.
Recently developed electronic packaging materials based on low dimensional materials such as carbon nanotubes, graphene, and hexagonal boron nitride h-BN exhibit advantageous electrical, thermal, and mechanical properties for protecting electronic devices as well as dissipating heat flux from highly integrated circuits or high power electronic devices. Their thermal transport is mainly achieved by precise control of the nanostructure for nano-fillers to form the thermally conductive pathway. However, due to the viscoelastic behaviors of host polymeric materials, their phase or structural stability is significantly reduced by enhanced molecular motion at high temperature, resulting in poor thermal transport and mechanical strength. Here, we introduce flexible and robust h-BN foam sheets with a three-dimensional network structure, which exhibit much enhanced thermostability at high temperature. Furthermore, the additional infiltration of Fe 3 O 4 nanoparticles into those structures results in relatively high electromagnetic absorbing performance.
An overview of the driving forces for the increased importance of packaging and interconnection to progress in electronics is presented, with emphasis on the influence and importance of the role of polymers. Relevant information on market values for components is included, where appropriate. In addition, trends in interconnection and packaging, their combined role, and their market size are discussed. Examples are given in which plastic packaging can lead to substantial reductions in packaged IC cost. An extensive overview of polymer applications is presented, with special emphasis on thin films, protective gels, rigid encapsulants, and printed wiring board materials and processes. The chapter also indicates why the symposium and the book are timely and important, especially for those interested in the chemical aspects of these materials. These polyimides are found to exhibit intrinsic fluorescence.
Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems. Professor Deborah D.
Operations Management. The chapter focuses on the analysis of the impact of packaging in Operations Management OM along the whole supply chain. The product packaging system i. A typical supply chain is an end-to-end process with the main purpose of production, transportation, and distribution of products. In recent years, companies have started to consider packaging as a critical issue. Packaging concerns all activities of a company: from the purchasing of raw materials to the production and sale of finished products, and during transport and distribution.
Not a MyNAP member yet? Register for a free account to start saving and receiving special member only perks. Materials as a field is most commonly represented by ceramics, metals, and polymers. While noted improvements have taken place in the area of ceramics and metals, it is the field of polymers that has experienced an explosion in progress.
There are different requirements for digital and RF packages that translate into the need for unique materials for each application. The interconnecting and dielectric insulating requirements are presented for each application and the relevant material properties and characteristics are discussed. The fundamental material characteristics of materials are: dielectric constant, dielectric loss, thermal and electric conductivity, resistivity, moisture absorption, glass transition temperature, strength, time-dependent deformation creep , and fracture toughness.
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